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王榮昌

王榮昌 Jung-Chang Wang

主任

教授兼系主任

分機:7100、7109

E-mail:jcwang@mail.ntou.edu.tw

學歷

國立臺灣大學 機械 博士 
國立成功大學 機械 碩士 
國立成功大學 機械 學士

經歷

國立臺灣海洋大學輪機工程學系教授 
國立臺灣海洋大學輪機工程學系副教授
國立臺灣海洋大學輪機工程學系助理教授
邁科科技股份有限公司 熱流研發 協理 
協禧電機股份有限公司 熱源部 主任 
泓崴科技有限公司 CFD技術顧問 
私立南臺科技大學 機械系 兼任講師 
海邦科技股份有限公司 機構工程師

專長

兩相流研究分析、CFD數值方法、綠色節能工程設計分析、熱交換器效率分析、電子散熱模組、LED照明應用

學術服務與榮譽

 

授課科目

熱力學、鍋爐學、流體力學、航運講座、熱對流學、熱流實驗、論文寫作、熱傳與輻射、熱交換器設計、3C電子熱傳技術、LED熱傳實務分析、能源產業講座

著作目錄


 A.國際學術期刊
  1. Jung-Chang Wang,2021, Special Issue "Polymer Materials in Sensors, Actuators and Energy Conversion".( https://www.mdpi.com/journal/polymers/special_issues/Polymer_Materials_in_Sensors_Actuators_and_Energy_Conversion)
  2. Z.-C. Chen, T.-L. Chang, K.-W. Su, H.-S. Lee, and J.-C. Wang*, 2021, Application of self-heating graphene reinforced polyvinyl alcohol nanowires to high-sensitivity humidity detection, Sensors and Actuators B: Chemical, Vol. 327, January, 128934.(SCI) (IF=7.1)
  3. X. Hou, R.-T. Wang, S. Huang, and J.-C. Wang*, 2020, Thermoelectric Generation andThermophysical Properties of Metal Oxide Nanofluids,Journal of Marine Science and Technology-Taiwan, Vol.28, No.4, July/August,online. (SCI) (IF=0.62).
  4. P.-H. Yen and J.-C. Wang*, 2019, Power Generation and Electric Charge Density with Temperature Effect of Alumina Nanofluids using Dimensional Analysis, Energy Conversion and Management, Vol.186, April, pp.546-555.(SCI)(IF=6.377).
  5. R.-T. Wang and J.-C. Wang* , 2017, Analysis of Thermal Conductivity in HI-LEDs Lighting Materials, Journal of Mechanical Science and Technology, 31(6), June pp.2911-2921. (SCI) (IF=1.128).
  6. R.-T. Wang and J.-C. Wang* , 2017, Intelligent Dimensional and Thermal Performance Analysis of Al2O3 Nanofluid, Energy Conversion and Management, Vol.138, April, pp.686-697. (SCI) (IF=5.589).
  7. R.-T. Wang and J.-C. Wang* , 2016, Analyzing the Structural Designs and Thermal Performance of Nonmetal LED Lighting Devices of LED bulbs, International Journal of Heat and Mass Transfer, Vol. 99, August, pp.750-761. (SCI) (IF=3.458).
  8. R.-T. Wang and J.-C. Wang* , 2016, Alumina Nanofluids as Electrolytes Comparisons to Various Neutral Aqueous Solutions inside Battery, Journal of Mechanics, Vol. 32, No. 3, June, pp.369-379. (SCI) (IF=0.819).
  9. R.-T. Wang and J.-C. Wang* , 2015, Optimization of Heat Flow Analysis for Exceeding Hundred Watts in HI-LEDs Projectors, International Communications in Heat and Mass Transfer, Vol. 67, October, pp.153-162. (SCI) (IF=3.718).
  10. J.-C. Wang* and W.-J. Chen, 2015, Thermal Characterisation Analysis of Heat-Sink Heat Pipes under Forced Convection, International Journal of Mechanical Engineering and Automation, Vol. 2, No. 1, January, pp.14-21.
  11. J.-C. Wang* , 2014, L- and U-shaped Heat Pipes Thermal Modules with Twin Fans for Cooling of Electronic System under Variable Heat Source Areas, Heat and Mass Transfer, Vol. 50, issue 11, pp.1487-1498. (SCI) (IF=1.233).
  12. R.-T. Wang, Y.-W. Lee, S.-L. Chen, and J.-C. Wang* , 2014, Performance Effects of Heat Transfer and Geometry on Heat Pipes Thermal Modules under Forced Convection, International Communications in Heat and Mass Transfer, Vol. 57, October, pp.140-149. (SCI) (IF=3.718).
  13. J.-C. Wang* and L.-W. Ye, 2014, Thermoelectric Performances of Seawater and Al2O3 Nanofluids using Battery Facility, Advanced Shipping and Ocean Engineering, September, Vol. 3, Iss. 3, PP. 35-40.
  14. J.-C. Wang* , 2014, U- and L-shaped Heat Pipes Heat Sinks for Cooling Electronic Components Employed a Least Square Smoothing Method, Microelectronics Reliability, Vol. 54, Issues 6/7, June, pp.1344-1354. (SCI) (IF=1.371).
  15. J.-C. Wang* , 2014, Analyzing Thermal Module Developments and Trends in High-Power LED, International Journal of Photoenergy, Vol. 2014, Article ID 120452, May, 11 pages, doi:10.1155/2014/120452. (SCI) (IF=1.277).
  16. J.-C. Wang* , 2014, Thermal Module Design and Analysis of a 230 Watt LED Illumination Lamp under Three Incline Angles, Microelectronics Journal, Vol. 45, Issue 4, April, pp.416-423. (SCI) (IF=1.163).
  17. K.-C. Liu and J.-C. Wang, 2014, Analysis of thermal damage to laser irradiated tissue based on the dual-phase-lag model, International Journal of Heat and Mass Transfer, Vol. 70, March, pp.621-628. (SCI) (IF=3.458).
  18. W.-K. Lin, R.-T. Wang* and J.-C. Wang, 2014, The Performance Measurement of Marine Logistics Information Platform, WIT Transactions on Information and Communication Technologies, 58 Vol. I, pp. 43-49. (EI).
  19. J.-C. Wang* , 2013, Thermoelectric Transformation and Illuminative Performance Analysis of a Novel LED-MGVC Device, International Communications in Heat and Mass Transfer, Vol. 48, November, pp.80-85. (SCI) (IF=3.718).
  20. J.-C. Wang* and W.-C. Chiang, 2013, Researches on Thermo-Electric Properties of Seawater and Al2O3 Nanofluids, Applied Mechanics and Materials, Vol. 394, pp. 14-19. (EI).
  21. J.-C. Wang, C.-Y. Lin, T.-C. Chen 2013, Thermal performance of a vapor chamberbased plate of high-power LEDs filled with Al2O3 nanofluid, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, Vol. 13, No. 4, April, pp.2871-2878. (NSC 100-2221-E-019-064) (SCI) (IF=1.483).
  22. R.-T. Wang* , J.-C. Wang, and L.-M. Chen, 2013, Economic challenges for taiwan private senior high schools: Performance evaluation based on a revised indicators framework, Proceedings of 2012 3rd International Asia Conference on Industrial Engineering and Management Innovation, IEMI 2012, pp. 895-906. (EI).
  23. J.-C. Wang* , 2012, 3-D Numerical and Experimental Models for Flat and Embedded Heat Pipes Applied in High-end VGA Card Cooling System, International Communications in Heat and Mass Transfer, Vol. 39, Issue 9, November, pp.1360-1366. (SCI) (IF=3.718).
  24. J.-C. Wang* , 2012, Novel green illumination energy for LED with ocean battery materials, INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, Vol. 44, Nos. 3/4, pp.187-200. (SCI) (IF=0.488).
  25. R.-T. Wang and J.-C. Wang* , 2012, Analyzing the Pressure-Difference Phenomenon between the Condensing and Boiling Sections in a Heat Pipe Cooling System, International Communications in Heat and Mass Transfer, Vol. 39, Issue 3, March, pp.390-398. (SCI) (IF=3.718).
  26. J.-C. Wang* , 2012, LED with Ocean Battery, Advanced Materials Research, Vols. 378-379, pp. 646-649. (EI).
  27. J.-C. Wang* , 2011, Thermal Investigations on LEDs Vapor Chamber-Based Plates, International Communications in Heat and Mass Transfer, Vol.38, Issue 9, November, pp. 1206-1212. (SCI) (IF=3.718).
  28. C.-Y. Lin, J.-C. Wang and T.-C. Chen, 2011, Analysis of suspension and heat transfer characteristics of Al2O3 nanofluids prepared through ultrasonic vibration, Applied Energy, Vol. 88, Issue 12, pp. 4527-4533. (NSC 98-2221-E019-039) (SCI) (IF=7.182).
  29. J.-C. Wang* , and R.-T. Wang, 2011, A Novel Formula for Effective Thermal Conductivity of Vapor Chamber, EXPERIMENTAL TECHNIQUES, Vol. 35, Issue 5, September/October, pp.35-40. (SCI) (IF=0.932) (Web of Science ranked the paper in the category Engineering, Mechanical. And 69 from the top 500 cited articles from 2010 to 2014).
  30. R.-T. Wang, J.-C. Wang* , and T.-L. Chang, 2011, Experimental Analysis for Thermal Performance of a Vapor Chamber Applied to High-Performance Servers, Journal of Marine Science and Technology-Taiwan, Vol. 19, No. 4, July/August, pp.353-360. (SCI) (IF=0.305). (NTOU 校長設備費 and NSC 97-2218-E-019-003).
  31. J.-C. Wang* , 2011, Applied Vapor Chambers on Non-uniform Thermo Physical Conditions, Applied Physics, Vol. 1, pp.20-26.
  32. J.-C. Wang* , 2011, Investigations on Non-Condensation Gas of a Heat Pipe, Engineering, Vol. 3, pp.376-383.
  33. J.-C. Wang* , A.-T. Li, Y.-P. Tsai, and R.-Q. Hsu, 2011, Analysis for Diving Regulator Applying Local Heating Mechanism of Vapor Chamber in Insert Molding Process, International Communications in Heat and Mass Transfer, Vol. 38, Issue 2, February, pp.179-183. (SCI) (IF=3.718).(Invited Speaker for 2011 Turkey International Modern Medical Forum (2011 TIMF).
  34. J.-C. Wang* and Y.-P. Tsai, 2011, Analysis for Diving Regulator of Manufacturing Process, Advanced Materials Research, Vol. 213, pp. 68-72. (EI).
  35. Y.-P. Tsai, J.-C. Wang* , R.-Q. Hsu, 2011, The Effect of Vapor Chamber in an Injection Molding Process on Part Tensile Strength, EXPERIMENTAL TECHNIQUES, Vol. 35, Issue 1, January/February, pp.60-64. (SCI) (IF=0.932).
  36. J.-C. Wang* , 2011, L-type Heat Pipes Application in Electronic Cooling System, International Journal of Thermal Sciences, Vol.50 , Issue 1, January, pp.97-105. (NSC 98-2221-E019-039) (SCI) (IF=3.615).
  37. J.-C. Wang* , R.-T. Wang, T.-L. Chang, D.-S. Hwang, 2010, Development of 30 Watt High-Power LEDs Vapor Chamber-Based Plate, International Journal of Heat and Mass Transfer, Vol. 53 , Issue 19/20 , September, pp.3900-4001. (SCI) (IF=3.458) (NTOU 校長設備費 and NSC 97-2218-E-019-003).
  38. C.-C. Chang, Y.-F. Kuo, J.-C. Wang, and S.-L. Chen, 2010, Air Cooling for a Large Scale Motor, Applied Thermal Engineering, Vol.30, Issue 11-12, August, pp.1360-1368.(SCI) (IF=3.356).
  39. J.-C. Wang* , 2010, Development of Vapour Chamber-based VGA Thermal Module, International Journal of Numerical Methods for Heat & Fluid Flow, Vol.20, Issue 4, May, pp.416-428. (SCI) (IF=1.713).
  40. J.-C. Wang* , R.-T. Wang, C.-C. Chang and C.-L. Huang, 2010, Program for Rapid Computation of the Thermal Performance of a Heat Sink with Embedded Heat Pipes, Journal of the Chinese Society of Mechanical Engineers, Vol. 31, Issue 1, February, pp.21-28. (NSC 98-2221-E019-039) (SCI) (IF=0.130).
  41. J.-C. Wang* , 2009, Superposition Method to Investigate the Thermal Performance of Heat Sink with Embedded Heat Pipes, International Communications in Heat and Mass Transfer, Vol.36, Issue 7, August, pp. 686-692. (SCI) (IF=3.718).
  42. Y.-P. Tsai, J.-C. Wang* , 2009, Vapor Chamber in Injection Molding Process, International Review of Chemical Engineering (Rapid Communications), Vol.1, N.2, P.179-P.182.
  43. J.-C. Wang* , 2008, Novel Thermal Resistance Network Analysis of Heat Sink with Embedded Heat Pipes, Jordan Journal of Mechanical and Industrial Engineering, Vol. 2, No. 1, Mar., pp. 23-30.
  44. T.-L. Chang, J.-C. Wang, C.-C. Chen, Y.-W. Lee and T.-H. Chou, 2008, A NonFluorine Mold Release Agent for Ni Stamp in Nanoimprint Process, Microelectronic Engineering, Vol.85, Issue 7, July, pp. 1608-1612. (SCI) (IF=1.806).
  45. Y.-W. Chang, C.-H. Cheng, J.-C. Wang and S.-L. Chen, 2008, Heat Pipe for Cooling of Electronic Equipment, Energy Conversion and Management, Vol.49, Nov., pp.3398-3404. (SCI) (IF=5.589).
  46. J.-C. Wang, H.-S. Huang and S.-L. Chen, 2007, Experimental Investigations of Thermal Resistance of a Heat Sink with Horizontal Embedded Heat Pipes, International Communications in Heat and Mass Transfer, Vol.34, Issue 8, October, pp. 958-970. (SCI) (IF= 3.718).
  47. J.-C. Wang, S.-J. Lin, S.-L. Chen and W.-S. Lee, 2005, Charge and Discharge Characteristics of a Thermal Energy Storage Device, Experimental Heat Transfer, Vol. 18, No. 1, Jan.-Mar., pp. 45-60. (SCI) (IF = 1.522).
B.國內期刊
  1. 李國隆、王榮昌*,2017,到港期間輔助鍋爐使用廢油之可行性探討,船舶科技 49期,P.32-P.37.
  2. 王榮昌*、楊嘉安、林暐峻、陳彥均,2016,以熱阻方法逆向求解大型船舶機艙熱分佈情形,熱管理產業通訊,第43期.
  3. 王榮昌*、楊嘉安、葉力瑋,2016,導熱高分子複合材料熱傳導係數標準量測之建立,熱管理產業通訊,第41期,P. 69-P.75.
  4. 劉冠慶、劉國辰、王榮昌*,2015,三種LED散熱基板材料熱流照明性能分析之探討,熱管理產業通訊,第37期,P. 34-P.44.
  5. 邱千瑋、王榮昌*,2014,雙壓電片致動噴流風扇,熱管理產業通訊,第35期,P. 63-P.67.
  6. 呂亦筑、陳錫琦、王榮祖、王榮昌*,2014,探討船舶與海運人員靈性對於兩岸貨資的重要性,船舶科技44期,P.35-P.50.
  7. 王榮昌*、游富雄,2013,熱流分析孔洞式結構體作用在LED球泡燈,熱管理產業通訊,第32期,P. 58-P.65.
  8. 劉冠慶、劉國辰、王榮昌*,2013,300W_LED燈具鰭片之最佳化設計與實驗,熱管理產業通訊,第32期,P. 47-P.57.
  9. 王榮昌*、陳韋睿,2012,U型熱管熱沉散熱模組在不同熱源面積下之熱性能研究,熱管理產業通訊,第28期,P. 52-P.60.
  10. 王榮昌*、黃駿凌,2011,高功率LED照明結合發電晶片之熱流系統模組,熱管理產業通訊,第23期,P.33-P.42.
  11. 王榮昌*、陳韋睿,2011,雙風扇L型熱管熱沉散熱模組在不同風速下之熱性能探討,熱管理產業通訊,第22期,P.41-P.50. (最佳論文獎)
  12. 王榮昌*、黃國榮、黃駿凌,2010,微均溫板應用在LED之分析方法,熱管理產業通訊,第20期,P.42-P.47.
  13. 陳登傑、王榮昌*、林成原,2010,奈米流體於LED微均溫板之熱傳特性研究,熱管理產業通訊,第19期,P.31-P.38.
  14. 王榮昌*、陳登傑,2010,微均熱板應用於高效能的伺服器系統,熱管理產業通訊,第17期,P.26-P.32.
  15. 郭怡君、羅民芳、簡牧菁、王榮昌*、王榮祖,2009,鋰電池/BMS產業價值鏈暨專利分析,海運學報(2009),第十八卷,第一期,77-88.
  16. 王榮昌*,2009,應用發光二極體於節能燈具的探討,Combustion Quarterly 4(2009),Vol.18,No.1, P.3-P.11.
  17. 王榮昌*,2008,均熱板散熱模組最佳性能設計,2008台灣熱管理產業通訊(2008),第9期,P.24 - P.35.

CONFERENCE PAPERS

   A.國際學術研討會
  1. J.-C. Wang* , 2019, Thermoelectric Energy Generation System of Nanofluids, Paper ID: SK2-013. The 5th International Conference on Renewable Energy Technologies (ICRET 2019), January 26-28, 2019, Seoul, South Korea.
  2. J.-C. Wang* , 2018, Thermal Energy Storage of Alumina Nanofluids using Innovation Dimensional Analysis, Keynote Forum, 11th World Bioenergy Congress and Expo, July 02-04, 2018, Berlin, Germany.
  3. J.-C. Wang* , 2017, Power Generation Saving System of Alumina Nanofluids using Innovation Dimensional Analysis, Paper ID: MIPE-0011, International Conference on Mechanical, Industrial and Power Engineering (2017 MIPE), August 14-16, 2017, Osaka, Japan.
  4. J.-C. Wang* , 2017, Thermal Management of High-Brightness Materials, Paper ID: SICEAS-635, Seoul International Conference on Engineering and Applied Science (SICEAS 2017), February 7-9, 2017, Seoul, South Korea.
  5. R.-T. Wang and J.-C. Wang* , 2015, 3-D Experimental Model Analysis of Heat Pipes Thermal Modules, Paper ID: ACENS-43, The Asian Conference on Engineering and Natural Sciences (ACENS 2015), February 3-5, 2015, Tokyo, Japan.
  6. R.-T. Wang, J.-C. Wang* , Guan-Cing Liu, 2014, Thermal System Analysis for HighPower LED Illumination Lamp Paper ID: 2152, International Conference on Engineering and Applied Science (ICEAS 2014), 22-24July, 2014, Hokkaido, Japan.
  7. J.-C. Wang* , 2014, Thermal Characterization Analysis of Heat-Sink Heat Pipes Under Forced Convection, Paper ID: 1004867, 10th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT2014), 14-16 July 2014, Orlando, USA.
  8. J.-C. Wang* and L.-W. Ye, 2014, Investigation on Thermo-Fluid Characteristics of Al2O3 Nanofluid using Power Generation Facility, Paper ID: 1185, ICAE2014: the 6th International Conference on Applied Energy, May 30-June 2, 2014, Taipei, Taiwan.
  9. W.-K. Lin, R.-T. Wang, J.-C. Wang, 2013, The Performance Measurement of Marine Logistics Information Platform, 2013 International Conference on Information and Communication Technology for Education (ICTE2013), December 1-2, 2013, Singapore.
  10. J.-C. Wang* and W.-C. Chiang, 2013, Researches on Thermo-Electric Properties of Seawater and Al2O3 Nanofluids, 2013 International Conference on Mechatronics, Applied Mechanics and Energy Engineering (MAMEE 2013), July 27-29, Singapore, pp. 1.
  11. J.-C. Wang* , W.-C. Chiang, C.-L. Huang and H.-L. Wu, 2012, GREENLIGHTING RECYCLABLE DEVICE OF LED-MGVC, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2012. IMPACT 2012. 7th International, pp. 98-101.(IEEE CNF; ISBN: 978-1-4673-1638-5) (EI).
  12. J.-C. Wang* , W.-J. Chen and F.-H. Yu, 2012, HSHPTM Program Application in Optimum of Heat Pipes Thermal Module, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2012. IMPACT 2012. 7th International, pp. 291- 294.(IEEE CNF; ISBN: 978-1-4673-1638-5) (EI).
  13. J.-C. Wang* and R.-T. Wang, 2012, LED-MGVC Using Computer Aided Modeling Design, the 2nd International Conference on Computer Science and Logistics Engineering (ICCSLE2012), Oct. 19~21, 2012 in Zhengzhou, China.
  14. R.-T. Wang, J.-C. Wang and L.-M. Chen, 2012, ECONOMIC CHALLENGES FOR TAIWAN PRIVATE SENIOR HIGHSCHOOLS: PERFORMANCE EVALUATION BASED ONA REVISED INDICATORS FRAMEWORK, 2012 3rd International Asia Conference on industrial engineering and management innovation (IEMI2012), August 10-11, 2012, in Beijing, China (EI).
  15. J.-C. Wang* , 2012, Novel Marine Battery to Drive LED Display, 2012 Third International Multicomponent Polymer Conference Polymer (IMPC 2012), 23-25 March 2012, Kottayam, Kerala, India.
  16. J.-C. Wang* , 2012, LED with Ocean Battery, 2012 International Conference on Applied Materials and Electronics Engineering (AMEE 2012), Jan. 18~19, 2012 in HongKong.
  17. J.-C. Wang* and W.-J. Chen, 2011, Thermal Analysis for L-type Heat Pipes Heat Sink with Dual Fans, 11th International Conference on Fluid Control, Measurements, and Visualization (FLUCOME 2011), December 5th to 9th, 2011, in Keelung, Taiwan. (Paper No.: 117).
  18. J.-C. Wang* , T.-S. Sung and W.-P. Chen, 2011, Hyper-Generation LEDs VCPCB, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2011. IMPACT 2011. 6th International, pp.332-335.(IEEE CNF; ISBN: 978-1-4577-1388-0) (EI).
  19. J.-C. Wang* and W.-J. Chen, 2011, Vapor Chamber in High-end VGA Card, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2011. IMPACT 2011. 6th International, pp.393-396.(IEEE CNF; ISBN: 978-1-4577-1388-0) (EI).
  20. R.-T. Wang and J.-C. Wang, 2011, Green Illumination Techniques applying LEDs Lighting, Proceedings of GETM 2011 May 28, pp.1-7, Changhua, Taiwan.
  21. J.-C. Wang* and Y.-P. Tsai, 2011, Analysis for Diving Regulator of Manufacturing Process, 2011 International Conference on Advanced Material Research (ICAMR 2011), 21-23 January 2011, in Chongqing, China.
  22. J.-C. Wang* and C.-L. Huang, 2010, VAPOR CHAMBER IN HIGH POWER LEDS, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2010. IMPACT 2010. 5th International, pp.1-4.(IEEE CNF; ISBN: 978-1-4244-9783- 6) (EI).
  23. T.-L. Chang, H.-P. Yang, Y.-H. Kuo, J.-C. Wang, C.-P. Wang, 2010, Circular Optical Microstructures Fabricated Using Ultra-Pulsed Laser Ablation and UV Imprint Process, 36th International Micro- and Nano- EngineeringConference (MNE2010), Genoa, Italy P-NANO-68.
  24. J.-C. Wang* , T.-L. Chang and Y.-K. Chang, 2010, Window Program of Heat Sink Heat Pipes Thermal Module, 7th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, HEFAT2010, 19-21 July 2010, Antalya, Turkey.
  25. J.-C. Wang* , and Y.-P. Tsai, 2010, Investigations on Scuba Diving Regulators, 29th International Conference on Ocean, Offshore and Arctic Engineering: Vol. 2, OMAE2010, June 6-11, 2010, Shanghai, China. Paper no. OMAE2010-21089 pp. 767-772.
  26. J.-C. Wang* and T.-C. Chen, 2009, Vapor Chamber in High Performance Server, Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International, pp.364-367.(IEEE CNF; ISBN: 978-1-4244-4341-3) (EI) (NTOU 校長設備費 and NSC 97-2218-E-019-003).
  27. J.-C. Wang* , 2009, Developing Window Program of Heat Sink with Embedded Heat Pipes, Proceedings of the Fourth International Conference on Thermal Engineering: Theory and Applications, January 12-14, 2009, Abu Dhabi, UAE,P.1-P.7.
  28. Y.-P. Tsai and J.-C. Wang, 2008, The Effects of Rotor Incorporated Mold for the Elimination of the Welding Line in Injection Molding, ANTEC. (EI). 
  29. T.-L. Chang and J.-C. Wang, 2007, Study of Nanopattern Forming with Chemical Coatings for Silicon–Based Stamp in Nanoimprint Process, Processing of IEEE-NANO, pp. 795-798. (IEEE CNF; ISBN: 978-1-4244-0607-4) (EI).
  30. T.-L. Chang and J.-C. Wang, 2007, Study of Nanopattern Forming with Chemical Coatings for Silicon–Based Stamp in Nanoimprint Process, Proceedings of the 7th IEEE, International Conference on Nanotechnology, August 2 - 5, 2007, Hong Kong.
  31. T.-L. Chang, J.-C. Wang, W.-L. Lai, C.-C. Chen, H.-Y. Lin, F.-H. Ko, F.-Y. Chang, S.-H. Chang, 2007, A Novel Non-Fluorine Mold Release Agent for Ni Stamp in Nanoimprint Process, 33rd International Conference on Micro- and Nano-Engineering, 23-26 September 2007, Copenhagen, Denmark.
  32. T.-L. Chang, J.-C. Wang, Y.-J. Tsai, Y.-R. Huang and C.-C. Chen, 2007, Study of Ni Nanopattern Stamps with Non-Fluorine Coating Treatment in Nanoimprint Process, 14th Symposium on Nano Device Technology (SNDT2007), Hsinchu, Taiwan, No.T5- 32.
  33. H.-S. Huang, J.-C. Wang and S.-L. Chen, 2007, Experimental Investigation on Thermal Performance of Heat Sink with Two Pairs of Embedded Heat Pipes, Proceedings of IPACK2007, ASME InterPACK`07.
  34. J.-C. Wang and S.-L. Chen, 2007, Thermal Performance of Two-Phase Closed Thermosyphon Cooling System, Proceedings of the Third International Conference on Thermal Engineering: Theory and Applications May 21-23, Amman, Jordan.
B.國內研討會
  1. 陳彥均、王榮昌,2016,氧化鈦奈米流體熱電性能分析,2016台灣熱管理協會年會暨技術成果發表會。
  2. 楊嘉安、林暐峻、王榮昌,2016,以熱阻方法逆向求解大型船舶機艙熱分布情形,2016台灣熱管理協會年會暨技術成果發表會。
  3. 王榮昌、楊嘉安,2015,以逆向運算配合熱阻網路法分析雲豹甲車動力艙之冷卻性能,中國機械工程學會第32屆全國學術研討會(論文編號:0334)。
  4. 王榮昌、邱千瑋、林暐峻,2015,壓電致動式噴流散熱器之性能分析,中國機械工程學會第32屆全國學術研討會(論文編號:0396)。
  5. 王榮昌、陳彥均、葉力瑋,2015,重複變數法於熱電奈米流體之初探,中國機械工程學會第32屆全國學術研討會(論文編號:0444)。
  6. 陳遠新、王榮昌、葉力瑋、陳彥均、楊嘉安、邱千瑋,引擎熱交換器工作流體研製與熱電性能經驗公式推導,第五屆海峽兩岸海洋工程和航海技術研討會,台灣基隆,11 月12-16 日。(論文編號:OEMT17)。
  7. 王榮昌、楊嘉安,2015,動態操作下車輛動力艙冷卻性能之分析,中華民國第二十屆車輛工程學術研討會,台灣彰化,11 月13 日。(論文編號:A-003)。
  8. 王榮昌、楊嘉安,2015,車輛動力艙冷卻性能之分析,第22屆全國計算流體力學學術研討會(論文編號:competition_O08)。新北市,中華民國104年8月26-28日。
  9. 邱千瑋、王榮昌,2014,雙壓電片致動噴流風扇之設計與分析,中國機械工程學會第31屆全國學術研討會(論文編號:00868)。
  10. 葉力瑋、王榮昌,2014,Al2O3奈米流體之熱電性能分析,中國機械工程學會第31屆全國學術研討會(論文編號:00872)。
  11. 王榮昌、楊嘉安,2014,以數值模擬方法探討裝甲車輛動力系統冷卻性能,中華民國第十九屆車輛工程學術研討會,台灣中壢,11 月14 日。(論文編號:H-02)。
  12. 劉冠慶、劉國辰、王榮昌,2014,不同散熱基板材料應用於LED之熱流照明性能分析,2014台灣熱管理協會年會暨技術成果發表會。
  13. 邱千瑋、王榮昌,2014,雙壓電片致動噴流風扇,2014台灣熱管理協會年會暨技術成果發表會。
  14. 吳皇霖、劉國基、王榮昌,2014,熱致發電型元件的研製與分析,中華民國燃燒學會第24屆燃燒與能源學術研討會論文集,論文編號:054,台南,台灣。
  15. 游富雄、王榮昌,2013,最佳化非金屬LED球泡燈結構體之熱流分析設計,2013虎門科技第22屆CAE應用年會。(最佳論文獎)
  16. 劉冠慶、劉國辰、王榮昌,2013,百瓦等級高功率LED投射燈之熱流分析與實驗,中國機械工程學會第30屆全國學術研討會(論文編號:1338)。
  17. 吳皇霖、劉國基、王榮昌,2013,數值模擬切削液槽中雜質的流動及沉澱現象,第20屆計算流體力學研討會(論文編號:12-5)。南投,中華民國102年8月21-23日。
  18. 王榮昌、姜玟州、李彥瑾、廖莉婷,2013,海水暨奈米流體電性能之研究,2013綠色科技工程與應用研討會(GTEA),論文編號:GT9022,臺中市,台灣,中華民國。
  19. 吳皇霖、劉國基、王榮昌,2013,發電晶片的製程與性能之探討,中華民國燃燒學會第23屆燃燒與能源學術研討會論文集,論文編號:C1_201303111746442013(EE206),新竹,台灣。
  20. 劉冠慶、劉國辰、王榮昌,2013,LED 投射燈散熱分析與實驗,2013台灣熱管理協會年會暨技術成果發表會。
  21. 王榮昌、游富雄,2013,孔洞式複合材料作用在LED 球泡燈上,2013台灣熱管理協會年會暨技術成果發表會。
  22. 王榮昌、姜玟州,2012,海水暨奈米材料電池性能之研究,中國機械工程學會第29屆全國學術研討會(論文編號:1968)。
  23. 游富雄、王榮昌、陳韋睿,2012,預測L及U型熱管熱沉散熱模組之熱管性能曲線及其熱性能,第三十六屆全國力學學術研討會(論文編號:Y-008)。
  24. 王榮昌、楊嘉安、葉力瑋,2012,穩態熱傳逆向數值求解熱傳導係數,第十九屆全國計算流體力學學術研討會(論文編號:0060)。
  25. 陳雅婷、謝寬永、王榮昌,2012,利用數值模擬方法探討平面網地特性之研究,第十九屆全國計算流體力學學術研討會(論文編號:0011)。
  26. 王榮昌、張宜岡,2012,應用萃思創新發明專利於電動車熱管理設計,第六屆創新管理學術與實務研討會。(論文佳作獎)
  27. 王榮昌、姜玟州、陳婉屏,2012,分析LED球泡燈之熱流照明性能,中華民國第二十二屆燃燒與能源學術研討會,論文編號:P-30,高雄,台灣。
  28. 王榮昌、陳韋睿,2012,熱管熱沉散熱模組在不同熱源面積下之熱性能研究,2012台灣熱管理協會年會暨技術成果發表會。
  29. 王榮昌、楊嘉安、葉力瑋,2012,導熱塑膠之等效熱傳導係數性能分析與比較,2012台灣熱管理協會年會暨技術成果發表會。
  30. 王榮昌、陳韋睿,2011,不同風扇數量下U型熱管熱沉散熱模組之熱性能探討,中國機械工程學會第28屆全國學術研討會(論文編號:A05-014)。
  31. 王榮昌、黃駿凌,2011,高功率LED照明結合發電晶片之熱流系統模組,2011台灣熱管理協會年會暨技術成果發表會。
  32. 王榮昌、陳韋睿,2011,雙風扇L型熱管熱沉散熱模組在不同風速下之熱性能探討,2011台灣熱管理協會年會暨技術成果發表會。
  33. 童柏仁、林成原、王榮昌,2011,利用超重力技術製作乳化柴油探討,中華民國第二十一屆燃燒與能源學術研討會,論文編號:A-06,雲林,台灣。
  34. 王榮昌、黃駿凌,2010,高功率LED 照明結合發電晶片之性能分析,中國機械工程學會第27 屆全國學術研討會(論文編號:AA10-006)。
  35. 王榮昌、陳登傑、黃駿凌,2010,發光二極體微均熱基板之熱性能研究,第十七屆全國計算流體力學學術研討會。
  36. 王榮昌、郭怡君、王榮祖,2010,台灣鋰電池產業之產業價值鏈研究,2010當代商管學域研討會,國立臺中技術學院。
  37. 王榮昌、黃國榮、黃駿凌,2010,微均溫板應用在LED之分析方法,2010台灣熱管理協會年會暨技術成果發表會。
  38. 王榮昌、林成原、陳登傑,2010,Al2O3奈米流體備製與微均溫板熱性能,2010台灣熱管理協會年會暨技術成果發表會。
  39. 王榮昌、王榮祖,民97年,航空站財務績效評估指標架構之建立,中華企業評價學會年會暨2008績效評估與價值創造研討會,中興大學。
  40. 王榮昌,2008,微均熱板顯示卡散熱模組的開發,第十五屆全國計算流體力學學術研討會。
  41. 王榮昌、蘇嘉宏,2008,單根熱管效能模擬分析,第十五屆全國計算流體力學學術研討會。
  42. 王榮昌,2007,探討均熱板之等效K值及其相關應用,2007台灣熱管理產業年會暨技術成果發表會。
  43. 王榮昌,2007,應用熱板於顯示卡散熱模組之性能研究,2007 TAIWAN ANSYS /Fluent USER CONFERENCE。
  44. 蔡毓斌、王榮昌、李艾聰、徐瑞坤,民96,熱板循環式冷卻加熱系統應用於射出成型製程之研究,2007模具技術與成果發表會。
  45. 王榮昌,2006,應用於微流道噴嘴噴射流動的現象,FLOW-3DÒ  2006年台灣區使用者大會。
  46. 王榮昌,2005,兩相流之沸騰現象的探討,FLOW-3DÒ  2005年台灣區使用者大會。

研究計畫

政府單位計畫案(2/18)

1.因次分析新一代熱電奈米流體熱電管研製(1,902,000 元) ,MOST 105-2221-E-019 -064 -MY2,105/08/01~107/07/31(執行中)

2.節能噴流無軸承風扇之研究開發(1,000,000 元),MOST 104-2623- E-019 -001 -ET,105/01/01~105/12/31(執行中)

3.八輪甲車動力系統冷卻性能提升分析(II)(714,000 元) ,MOST 104-2623-E-019 -001 -D,104/01/01~104/12/31(已結案)

4.熱流性能實驗搭配最小平方法分析 U 型及 L 型熱管熱沉模組性能(751,000元),MOST 103-2221-E-019-025- ,103/08/01~104/07/31(已結案)

5.八輪甲車動力系統冷卻性能提升分析(802,000 元) ,NSC 103- 2623-E-019 -001 -D,103/01/01~103/12/31(已結案)

6.探討熱電奈米等級工作流體應用於增強 VC 及 HP 的熱傳性能與微發電效率之研究(793,000 元),NSC 102-2221-E-019 -045 -,102/08/01~103/07/31(已結案)

7.熱流照明實驗搭配暫態熱傳方法分析 LED 複合材料基板暨燈具之性能量測建立(360,000 元),NSC 101 - 2622 - E - 019 - 006 -CC3,101/11/01~102/10/31(已結案)

8.LED 微發電均溫板元件之研製(II) (833,000 元),NSC 101 - 2221 -E - 019 - 042 -,101/08/01~102/07/31(已結案)

9.LED 微發電均溫板元件之研製(682,000 元),NSC 100 - 2221 - E - 019 - 064 -,100/08/01~101/07/31(已結案)

10.微尺度冷凝沸騰壓差現象之探討暨視窗軟體開發(667,000 元),NSC 99-2221-E-019 -018 -,99/08/01~100/07/31(已結案)

11.電動車感應馬達及驅動器之液冷系統研究(600,000 元) ,99/02/01~99/11/30(已結案)

12.國內感應馬達產業之調查研究(600,000 元),99/02/01~99/11/30(已結案)

13.九十九年度「跨領域-綠色科技」人才培育先導型計畫-海洋綠色能源科技學分學程-以綠能船舶為主軸(800,000 元),99/02/01-100/01/31(已結案)

14.嵌入式熱管熱沉散熱模組熱性能之分析暨視窗軟體開發(676,000 元),NSC 98 - 2221 - E - 019 - 039 -,98/08/01~99/07/31(已結案)

15.鋰電池 /BMS產 業 價 值 鏈 探 索 分 析 (600,000元 ) ,98/02/01~98/11/30(已結案)

16.九十八年度「跨領域-綠色科技」人才培育先導型計畫-海洋綠色能源科技學分學程-以綠能船舶為主軸(1,100,000 元),98/02/01-99/01/31(已結案)

17.微均溫板散熱模組熱性能之分析暨視窗軟體開發(640,000 元),NSC 97-2218-E-019 -003 -,97/10/01~98/07/31(已結案)

18.九十七年度「跨領域-綠色科技」人才培育先導型計畫-海洋綠色能源學分學程(1,000,000 元),97/02/01-98/01/31(已結案)

民間單位計畫案(0/8)

1.熱傳觀念暨實驗室建立(36,000 元) ,金江企業有限公司,2016/4/1~2016/6/30(已結案)

2.均溫板與戴森機構設計應用於 LED 散熱之研製與測試(3,000,000 元),長庚大學/聚積科技,2012/7/1~2015/06/30(已結案)

3.模擬分析導熱高分子材料應用於 LED 燈具外殼的性能(25,000 元),美好精密電子股份有限公司,2012/4/1~2012/5/15(已結案)

4.熱壓爐結構之模擬分析(60,000 元),楷翔自動化機械有限公司,2010/1/4~2010/2/26(已結案)

5.微小氣泡產生機構(75,000元 ) , 中 小 企 業 ,2009/10/19~2009/11/30(已結案)

6.可調式發熱電池 120 PCS(99,600 元),中科院/弘浩有限公司,2009/7/1~2009/10/31(已結案)

7.利用 Flow-3D 軟體分析鋅合金拉鍊之壓鑄成型(30,000 元),遠東科技大學,2009/7/1~2009/8/31(已結案)

8.電池模組熱傳模擬分析(98,600 元),中科院/泓崴科技有限公司,2009/7/1~2009/7/31(已結案)


專利

  1. 王榮昌、吳乙澤,”船舶警示監控系統” 中華民國發明專利,I714998,(2021)。
  2. 王榮昌、傅承運、蘇奕綸,”全封閉複合式波浪發電機” 中華民國發明專利,申請中,(2020)。
  3. 王榮昌、傅承運,”全封閉縱搖滑軌波浪發電裝置” 中華民國發明專,I6674009,(2020)。
  4. 王榮昌、傅承運,”全封閉縱搖滑軌波浪發電裝置” 中國大陸發明專利,申請案號 02841-0004-TW-1/02841-0004-CN-1,(2020)。
  5. 王榮祖、王榮昌、林暐峻,”封閉式壓電風扇” 中華民國發明專利,申請中,(2020)。
  6. 王榮昌 (Jung-Chang Wang)、王榮祖(Jung-Chu Wang)、陳彥均(Yen-ChunChen),”Thermoelectric Device” 美國發明專利,申請案號 15626400,(2020)。
  7. 王榮昌、王榮祖、陳彥均,”熱電元件” 中國大陸發明專利,證書號第 3688087號(2020)。
  8. 王榮祖、王榮昌、陳彥均,”熱電元件” 中華民國發明專利,I578597,(2017)
  9. 王榮昌、邱千瑋,”噴流致動風扇模組” 中華民國發明專利,I542793,(2016)。
  10. 王榮昌、王榮祖,”微發電均溫板” 中華民國發明專利,I544198,(2016)。
  11. 王榮昌、蘇程裕,”熱浮力散熱裝置” 中華民國專利,M470972,(2014)。
  12. 羅民芳、謝文桐、王榮昌、張宜岡,”模組化高功率馬達液冷系統” 中華民國發明專利,201225488,(2012)。
  13. 王榮昌、王榮祖,”發光二極體燈管之散熱結構” 中華民國專利,M374020,(2010)。
  14. 王榮昌、王榮祖,”供電子元件用之微均熱基板”,中華民國專利,M361859,(2009)。
  15. 王榮昌、王榮祖,”等效熱傳導係數測量裝置” 中華民國專利,M358298,(2009)。
  16. 王榮昌、王榮祖,”新型散熱片” 中華民國專利,M357180,(2009)。

專書

  1. J.-C. Wang* and S.-L. Chen, 2011, Book Title is Heat Transfer - Engineering Applications ( ISBN 978-953-307-361-3 ), Chapter Title is Air cooling module applications to consumer - electronic products, InTech Open Access Publisher, Chapter 14 pp.339-366 (https://www.intechopen.com/books/heat-transfer-engineering-applications/air-cooling-module-applications-to-consumer-electronic-products).
  2. J.-C. Wang*, T.-L. Chang, and Y.-W. Le, 2012, Book Title is Some Critical Issues for Injection Molding ( ISBN 978-953-51-0297-7 ), Chapter Title is Insert Molding Process Employing Vapour Chamber, InTech Open Access Publisher, Chapter 9 pp.205-224 (https://www.intechopen.com/books/some-critical-issues-for-injection-molding/insert-molding-process-employing-vapor-chamber).
  3. J.-C. Wang* , 2012, Book Title is Computer Aided Design: Technology, Types and Practical Applications ( ISBN 978-1-62257-346-2 ), Chapter Title is Computer AidedThermal Module Design, Nova Publisher, Pub. Date: 2012-December, Chapter1pp.1-34.
  4. J.-C. Wang* , 2013, Series Title is NANTOTECHNOLOGY( ISBN 1-62699-000-X ), Volume No. and Title is Vol.4: Nanomaterials and Nanostructures (1-62699-004-2 ), Chapter Title is Preparing Thermo-Electric Nanofluid, Studium Press LLC Publisher, Chapter 8 pp.222-236.
  5. J.-C. Wang* , 2014, Book Title is Horizons in Computer Science Research. Volume 9 ( ISBN 978-1-63321-522-1 ), Chapter Title is Computer Aided-Thermal Module Design, Nova Publisher, Pub. Date: 2014 - 3rd Quarter Chapter 11 pp.251-284.
  6. J.-C. Wang* , 2017, Book Title is Advances in Nanotechnology. Volume 19 ( ISBN 978-1-53612-415-6 ), Chapter Title is Advances in Nanofluidics Research, Nova Publisher, Pub. Date: 2017 - 3rd Quarter Chapter 6 pp.173-210
  7. J.-C. Wang* , 2018, Book Title is Heat Pipes: Design, Applications and Technology ( ISBN 978-1-53613-908-2 ), Chapter Title is Various Shaped Heat Pipe Applications and HSHPTM Software, Nova Publisher, Pub. Date: 2018 - September Chapter 6 pp.365-394